Synergistic Advancement of SMT & BGA Tech

From the SMT welding point of view, the assembly tolerance of the BGA chip is 0.3 mm, which is much lower than the preceding QFP chip of 0.08 mm. In general, if the provision of SMT patches is carried out on spaces with a small finger size or even smaller, greater assembly tolerance means higher reliability and mounting precision.

Suppose therefore that a large -scale integrated circuit has 400 E / S electrode pins, and the step of the pins is 1.27 mm, while a traditional QFP chip 4 sides, each side has 100 pins, so the final side length is at least 127 mm. In this way, the entire surface of the chip must be 160 (square centimeters).

If we use a BGA package to treat it, the electrode pins of the SMT mounted chip are arranged uniformly below the 20 * 20 row chip, with a maximum side length of only 25.4 mm and a volume ratio of less than 7 (square centimeters).

According to the above analysis, we can summarize two enormous progress:

1: the number of fleeing welding pins becomes smaller

As the saying says, “the more you do, the more mistakes you make.” On the contrary, we try to reduce the number and welding procedures as little as possible, and the probability of errors will become less. Therefore, the smallest number of welding pins is an important method that can improve the quality and reliability of welding. It can also be indirectly said that BGA packaging has enormous technological advantages and development potential compared to traditional QFP packaging.

2: The welding volume becomes smaller

Of the CEO of Tesla, Elon. Brain interface of musk with the skinto showWhat we see for screens is not only technological progress, but also a very intelligent and miniaturized application of products. After all, it is impossible for people to keep a computer of several kilograms every day. Consequently, the change in welding volume is also in accordance with a future development trend and is also a huge late advantage of the BGA packaging.

Therefore, whether from the PCBA contract and material contracts or the future development trend, we must have a brilliant future for the development of BGA packaging.

In the end: Shenzhen Jingbang Electronics undertakes the treatment of SMT patches as a BGA welding at a single window, and the PCBA treatment 20 years of experience in the industry, with reputation and trustworthy!